Why nobody talks about how much thermal paste application has changed
I remember 10 years ago when I first started building PCs, everyone swore by the pea-sized dot method for applying thermal paste. That was the golden rule, you put a little dot in the middle and called it a day. Fast forward to last month and I'm swapping a cooler on a Ryzen 7 in Phoenix, and I decided to try the spread method with a plastic card. It was a total pain and took forever, plus I worried about getting air bubbles. Now I'm back to the pea method but with a tiny bit more paste since these newer chips have bigger heat spreaders. Has anyone else noticed that the old rules don't always work on these new CPUs, or is it just me?